As semiconductors become more highly integrated, it’s important to manage latency between processes as well as minimize wafer defects caused
by moisture, oxygen, and other substances within the wafer transport container. It is a system that quickly discharges substances that affect these
wafers to prevent a decrease in production yield.
Smart Purge System
Purging function using N2 and CDA (Clean Dry Air)
Apply different recipes by frame or port
Particle removal function that can be attached to nozzles
by pre or post purge application
Minimize N2 and CDA usage with feedback control and variable purge
Zero-Foot Print maximizes production line utilization
Minimize maintenance time through pneumatic parts boardization/simplification
Support for various Inlet and Outlet combinations
